MIRACLE BOND® repair epoxy is a multi-purpose, rapid cure, bonding and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and ideal for both overhead and vertical repairs, while still being easily dispensed from most dispensing guns. It has an application temperature range between 40 deg F (4 deg C) and 110 deg F (43 deg C).
- May be used as an adhesive or filler
- Capping paste and injection port adhesive for crack injection process
- Non-sag patching material for cracks and small spalls
- Ideal for overhead and vertical repairs
- Adhering replacement tile to surface of pool underwater by applying adhesive to dry tile and holding in place until initial tack
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Line Drawing
https://assets.unilogcorp.com/187/ITEM/DOC/MIRACLE_BOND_103022643_Line_Drawing.pdf
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SDS
https://assets.unilogcorp.com/187/ITEM/DOC/MIRACLE_BOND_103022643_SDS.pdf